Micro fluid system support and manufacturing method thereof

ABSTRACT

A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system.

This application is a divisional of U.S. application Ser. No.10/505,416, filed on Jun. 13, 2005, pending, which is a National Stageof International Application No. PCT/JP2003/02066, filed on Feb. 25,2003.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a support unit for a microfluidicsystem, in which a hollow filament is laid on and fixed to a support tohave a predetermined shape, and a manufacturing method thereof.

2. Description of the Related Art

In chemical and biochemical fields, studies have advanced tominiaturization of reaction systems and analyzers that usemicroelectromechanical systems (MEMS). In conventional research anddevelopment, there is a micron-scale machine element (referred to as“micromachine” hereinafter) having a single function as a micromotor ormicropump.

In order to conduct an intended chemical reaction or chemical analysis,it is necessary to combine a plurality of various micromachine partstogether and systemize them. A complete form of such system is referredto by such names as micro reactor system, or micro total analysis system(μTAS). Usually, micromachines are formed on a silicon chip by applyinga semiconductor manufacturing process. In principle, it is possible toform (integrate) a plurality of elements on one chip systemizing them,and efforts have been made in fact toward this operation. However, thefabrication process of the system is complicated, and it is assumeddifficult to manufacture the system at a mass production level. A chipsubstrate (referred to as nanoreactor hereinafter), where a groove isformed as a flow channel by etching or the like at a predeterminedposition in a silicon substrate, has been suggested as a method ofconnecting a plurality of micromachines to form a fluidic circuit(system). This method has an advantage in that manufacturing of thesystem is far easier than manufacturing of the system in theaforementioned method of integration. However, a cross-sectional area ofthe flow channel is small, and interface resistance between a fluid andthe side surface of the groove is large. Thus, under the presentcircumstances, the maximum length of the flow channel is not more thanmillimeters, and, in synthetic reactions and chemical reactions that areactually conducted, the number of steps and the amount of a fluid forreaction and analysis are limited.

However, the fabrication process of the system is complicated, and it isassumed difficult to manufacture the system at a mass production level.Therefore, in recent years, a chip substrate, where a groove is formedas a flow channel by etching or the like at a predetermined position ina silicon substrate, has been suggested as a method of connecting aplurality of micromachines to form a fluidic circuit. This method has anadvantage in that manufacturing of the system is far easier thanmanufacturing of the system in the aforementioned method of integration.However, on the other hand, this method has a problem in that across-sectional area of the flow channel is small, and interfaceresistance between a fluid and the side surface of the groove is large.Thus, under the present circumstances, the maximum length of the flowchannel is not more than millimeters, and, in synthetic reactions andchemical reactions that are actually conducted, the number of steps andthe amount of a fluid for reaction and analysis are limited.

SUMMARY OF THE INVENTION

The present invention was accomplished to resolve the above-describedproblem. In other words, an object of the present invention is toprovide a support unit for a microfluidic system, which is manufacturedeasily and has a long flow channel in centimeters that does not limitthe number of steps and an amount of a fluid for reaction and analysis.

Another object of the present invention is to provide a support unit fora small microfluidic system, which does not require space even with acomplicated fluidic circuit.

Yet another object of the present invention is to provide amanufacturing method for a support unit for a microfluidic system, inwhich a complicated fluidic circuit can be formed.

In order to achieve the above object, a first aspect of the presentinvention inheres in a support unit for a microfluidic system including(a) a first support, (b) a first adhesive layer provided on a surface ofthe first support, (c) a hollow filament laid on a surface of the firstadhesive layer to have an arbitrary shape, and (d) a hollow filamentlaid on the surface of the first adhesive layer to have an arbitraryshape and functioning as a flow channel layer of a microfluidic system.In the first aspect of the present invention, another hollow filamentcan be three-dimensionally laid in a manner of intersecting with saidhollow filament. Therefore, it becomes possible to provide a supportunit for a microfluidic system which has good accuracy, can bemanufactured easily and has a long flow channel in centimeters that doesnot limit the number of steps and the amount of a fluid for reaction andanalysis. Further, according to the first aspect of the presentinvention, it is possible to provide a support unit for a smallmicrofluidic system, which does not require space even with acomplicated fluidic circuit. Thus, it is also possible to downsize themicrofluidic system itself.

A second aspect of the present invention inheres in a support unit for amicrofluidic system including (a) a first support, (b) a first adhesivelayer provided on a surface of the first support, and (c) a first hollowfilament group constituted by a plurality of hollow filaments laid on asurface of the first adhesive layer to have an arbitral shape andrespectively functioning as a plurality of flow channel layers of themicrofluidic system. In the second aspect of the present invention, asecond hollow filament group constituted by a plurality of hollowfilaments can be three-dimensionally laid to intersect the first hollowfilament group constituted by the plurality of hollow filaments.Therefore, it becomes possible to provide a support unit for amicrofluidic system which has good accuracy, can be manufactured easilyand has a long flow channel in centimeters that does not limit thenumber of steps and the amount of a fluid for reaction and analysis.Further, according to the first aspect of the present invention, it ispossible to provide a support unit for a small microfluidic system,which does not require space even with a complicated fluidic circuit.Thus, it is also possible to downsize the microfluidic system itself.

A third aspect of the present invention inheres in a manufacturingmethod of a support unit for a microfluidic system including (a) forminga first adhesive layer on a surface of a first support, and (b) laying ahollow filament on a surface of the first adhesive layer. Themanufacturing method of a support unit for a microfluidic systemaccording to the third aspect of the present invention is amanufacturing method using the support unit for a microfluidic systemexplained in the first aspect. According to the third aspect of thepresent invention, it is possible to provide a manufacturing method of asupport unit for a small microfluidic system in which a complicatedfluidic circuit can be formed.

A fourth aspect of the present invention inheres in a manufacturingmethod of a support unit for a microfluidic system including (a) forminga first adhesive layer on a surface of a first support, and (b) laying afirst hollow filament group constituted by a plurality of hollowfilaments on a surface of the first adhesive layer. The manufacturingmethod of a support unit for a microfluidic system according to thefourth aspect of the present invention is a manufacturing method usingthe support unit for a microfluidic system described in the secondaspect. According to the fourth aspect of the present invention, it ispossible to provide a manufacturing method of a support unit for a smallmicrofluidic system in which a complicated fluidic circuit can beformed.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a cross sectional view of a support unit for a microfluidicsystem according to a first embodiment of the present invention, andFIG. 1B is a plan view whose cross section along the line IA-IA viewedin the arrow direction corresponds to FIG. 1A.

FIG. 2 is a process cross sectional view (No. 1) explaining amanufacturing method of the support unit for a microfluidic systemaccording to the first embodiment of the present invention.

FIG. 3A is a process cross sectional view (No. 2) explaining themanufacturing method of the support unit for a microfluidic systemaccording to the first embodiment of the present invention, and FIG. 3Bis a plan view whose cross section along the line IIIA-IIIA viewed inthe arrow direction corresponds to FIG. 3A.

FIG. 4A is a process cross sectional view (No. 3) explaining themanufacturing method of the support unit for a microfluidic systemaccording to the first embodiment of the present invention, and FIG. 4Bis a plan view whose cross section along the line IVA-IVA viewed in thearrow direction corresponds to FIG. 4A.

FIG. 5A is a process cross sectional view (No. 4) explaining themanufacturing method of the support unit for a microfluidic systemaccording to the first embodiment of the present invention, and FIG. 5Bis a plan view whose cross section along the line VA-VA viewed in thearrow direction corresponds to FIG. 5A.

FIG. 6A is a process cross sectional view (No. 5) explaining themanufacturing method of the support unit for a microfluidic systemaccording to the first embodiment of the present invention, and FIG. 6Bis a plan view whose cross section along the line VIA-VIA viewed in thearrow direction corresponds to FIG. 6A.

FIG. 7A is a process cross sectional view (No. 6) explaining themanufacturing method of the support unit for a microfluidic systemaccording to the first embodiment of the present invention, and FIG. 7Bis a plan view whose cross section along the line VIIA-VIIA viewed inthe arrow direction corresponds to FIG. 7A.

FIG. 8A is a bird's eye view of a support unit for a microfluidic systemincluding a relay portion according to a second embodiment of thepresent invention, and FIG. 8B is a cross sectional view along the lineVIIIB-VIIIB.

FIG. 9A is a bird's eye view (No. 1) explaining a configuration of ahollow filament for a support unit for a microfluidic system accordingto another embodiment of the present invention, and FIG. 9B is a bird'seye view (No. 2) explaining a configuration of a hollow filament for asupport unit for a microfluidic system according to another embodimentof the present invention.

FIG. 10 is a cross sectional view of a support unit for a microfluidicsystem including a relay portion according to another embodiment of thepresent invention.

FIG. 11A is a cross sectional view viewed in the arrow direction alongthe line XIA-XIA of a plan view of a support unit for a microfluidicsystem shown in FIG. 11C, according to yet another embodiment of thepresent invention, FIG. 11B is a cross sectional view viewed in thearrow direction along the line XIB-XIB of the plan view shown in FIG.11C.

FIG. 12 is a bird's eye view of the support unit for a microfluidicsystem according to yet another embodiment of the present inventionshown in FIGS. 11A to 11C.

FIG. 13 is a bird's eye view showing a modification of the support unitfor a microfluidic system according to yet another embodiment of thepresent invention.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments of the present invention are described with reference to thedrawings. The same or similar parts are denoted by the same or similarsymbols. However, the drawings are schematic, and a relation between athickness and a dimension of a plane, a ratio between thicknesses ofrespective layers, and the like are different from those in reality.Therefore, specific thicknesses and dimensions should be determined bychecking the description below. In addition, between the drawings,relationship and ratio between dimensions may of course be different.

First Embodiment (Support Unit for Microfluidic System)

As shown in FIGS. 1A and 1B, a support unit for a microfluidic systemaccording to a first embodiment of the present invention includes afirst support 2, a first adhesive layer 1 a provided on a surface of thefirst support 2, a first hollow filament group constituted by aplurality of hollow filaments 501, 502, 503, . . . , 508 laid on asurface of the first adhesive layer to have an arbitrary shape, a secondhollow filament group constituted by a plurality of hollow filaments511, 512, 513, . . . , 518 laid in a direction intersecting with thefirst hollow filament group, a second adhesive layer 1 b provided on asurface of the second hollow filament group, and a second support 6provided on a surface of the second adhesive layer 1 b. The first hollowfilament group constituted by the plurality of hollow filaments 501,502, 503, . . . , 508 and the second hollow filament group constitutedby the plurality of hollow filaments 511, 512, 513, . . . , 518respectively configure flow channel layers for a chemical solution, inthe support unit for a microfluidic system according to the firstembodiment of the present invention.

The inner diameters and outer diameters of the plurality of hollowfilaments 501 to 508 and 511 to 518 may be selected depending on apurpose. However, the inner diameters preferably range from about φ0.05mm to φ0.5 mm since milliliters (mL) to microliters (μL) of fluid isflown therethrough. In fabricating the hollow filaments 501 to 508 and511 to 518 with the above diameters, particularly suitable materials forthe hollow filaments are polyimide (PI), polyether ether ketone (PEEK),polyether imide (PEI), polyphenylene sulfide (PPS),tetrafluoroethylene-perfluoroalkoxyethylene copolymer (PFA), and thelike. With inner diameters of φ0.05 mm or smaller, an influence of theinterface resistance between the fluid and the inner wall surfaces ofthe hollow filaments 501 to 508 and 511 to 518 becomes too great to beignored. On the other hand, with inner diameters larger than φ0.5 mm,high pressure is required to allow the fluid to flow continuously, thuscausing an increase in burdens on other parts and mixing of air bubblesinto the fluid. When causing a chemical reaction in the fluid flowingthrough the first hollow filament group constituted by the plurality ofhollow filaments 501 to 508 and the second hollow filament groupconstituted by the plurality of hollow filaments 511 to 518, it ispreferred that the hollow filaments 501 to 508 and 511 to 518 bechemical resistant. Further, when causing a photochemical reaction orperforming spectroscopic analysis by illuminating the fluid flowingthrough the hollow filaments 501 to 508 and 511 to 518, it is preferredthat the hollow filaments 501 to 508 and 511 to 518 be transparent. Avalue of light transmittance may depend on purpose, but the value ispreferably 80% or more with a target wavelength, and the value of 90% ormore is optimal. In other words, as shown in FIG. 9A, it is preferredthat the second support 6, the second adhesive layer 1 b, and a hollowfilament 58 be transparent at a predetermined position, or that thehollow filament 58 be exposed and at least the exposed portion of thehollow filament 58 be transparent.

In comparison with a free state, fixing the hollow filaments 501 to 508and 511 to 518 to the first support 2 produces an excellent advantage inthat various environments around the hollow filaments such astemperature, an electric field, and a magnetic field can be easilycontrolled. This is advantageous in performing a chemical reaction orchemical analysis, and is particularly essential for micronized reactionsystem and analysis system. There is another advantage in that thehollow filaments 501 to 508 and 511 to 518 are easily aligned with andconnected to parts, and a number of the hollow filaments 501 to 508 and511 to 518 can be accommodated compactly.

Further, when performing chemical analysis, providing the plurality ofhollow filaments 501 to 508 and 511 to 518 is advantageous in thatoperation efficiency is improved. In this case, it is required that thelengths of the plurality of hollow filaments 501 to 508 constituting thefirst hollow filament group are equal to each other from a viewpointthat, when the analysis starts simultaneously in the hollow filaments,results of the analysis should be obtained almost simultaneously.Similarly, it is required that the lengths of the plurality of hollowfilaments 511 to 518 constituting the second hollow filament group areequal to each other. In other words, it is important that amounts ofenergy applied from the outside to the inlets through the outlets for asample are uniform, and that there is little difference between theamounts of energy applied to the hollow filaments. From this viewpoint,it is preferred that the hollow filaments 501 to 508 and 511 to 518 besandwiched by at least two supports so that distribution of heatconducted through the hollow filaments 501 to 508 and 511 to 518 isuniform.

Moreover, it is preferred that the plurality of hollow filaments 501 to508 constituting the first hollow filament group and the plurality ofhollow filaments 511 to 518 constituting the second hollow filamentgroup be arrayed at mutually equal intervals. Furthermore, it ispreferred that the plurality of hollow filaments 501 to 508 constitutingthe first hollow filament group and the plurality of hollow filaments511 to 518 constituting the second hollow filament group have a uniformtube thickness.

Commercially available tubes made from various materials can be used forthe plurality of hollow filaments 501 to 508 and 511 to 518, and tubesmade of an arbitrary material may be selected depending on a purpose.These materials include, for example, an organic material such aspolyvinyl chloride resin (PVC), polyvinylidene chloride resin, polyvinylacetate resin, polyvinyl alcohol resin (PVA), polystyrene resin (PS),acrylonitrile butadiene styrene copolymer (ABS), polyethylene resin(PE), ethylene-vinyl acetate copolymer (EVA), polypropylene resin (PP),poly-4-methylpentene (TPX), polymethyl methacrylate (PMMA), PEEK, PI,PEI, PPS, cellulose acetate, polytetrafluoroethylene resin (PTFE),tetrafluoroethylene-hexafluoropropylene resin (FEP), PFA,polyethylene-tetrafluoroethylene copolymer (ETFE),polychlorotrifluoro-ethylene (PCTFE), polyvinylidene fluoride (PVDF),polyethylene terephthalate resin (PET), polyamide resin (nylon),polyacetal (POM), polyphenylene terephthalate (PPT), polycarbonate resin(PC), polyurethane resin, polyesterelastomer, polyolefin resin, siliconeresin, and polyimide resin, and an inorganic material such as glass,quartz, and carbon.

Material type, shape and size of the first support 2 may be selecteddepending on a purpose. An appropriate range of the board thickness orfilm thickness of the first support 2 is differentiated depending on apurpose or a required function. For example, where electrical insulationproperties are required in the first support 2, selected is an epoxyresin board or a polyimide resin board used for a printed wiring board,a polyimide film represented by Kapton film by DuPont Corporation usedfor a flexible printed wiring board, or a PET film represented byLumirror Film by Toray Industries Inc. It is preferred that the firstsupport 2 have a large board thickness (film thickness), and thethickness of 0.05 mm or larger is particularly preferred. Moreover,where heat dissipation properties are required in the first support 2, ametal board such as an aluminum (Al) board, a copper (Cu) board, astainless steel board, and a titanium (Ti) board is selected. It ispreferred that the thickness of the first support 2 is even thicker, andthe thickness of 0.5 mm or larger is particularly preferred. Further,where light transmittivity is required in the first support 2, selectedis a board made of a transparent inorganic material such as glass andquartz, or a board or film made of a transparent organic material suchas polycarbonate and acryl. It is preferred that the first support 2 hasa small board thickness (film thickness), and a thickness of 0.5 mm orsmaller is particularly preferred. It is also possible to use so-termedflexible circuit board or printed circuit board in which a metal patternsuch as a copper pattern is formed on the surface of the first support 2by etching or plating. In virtue of this, it becomes possible to form aterminal or a circuit which implements various parts and elements suchas a micromachine, a heater element, a piezoelectric element, varioussensors including those of temperature, pressure, distortion, vibration,voltage, magnetic field, and the like, an electronic part such as aresistor, a capacitor, a coil, a transistor, and an IC, and an opticalpart such as a laser diode (LD), a light emitting diode (LED) and aphotodiode (PD). Thus, systemization becomes easy.

The first adhesive layer 1 a formed on the surface of the first support2 is preferably a pressure sensitive or photosensitive adhesive. Thesematerials realize stickiness or adhesion by application of pressure orlight thereto. Therefore, these materials are suitable for the casewhere the hollow filaments (hollow capillaries) are mechanically laid.As for the pressure sensitive adhesive, a high-molecular weightsynthetic rubber adhesive or a silicone resin adhesive is appropriate.The high-molecular weight synthetic rubber maybe, for example,polyisobutylene such as Vistanex MML-120 by Tonex Co., Ltd.,acrylonitrile-butadiene rubber such as Nipol N1432 by Zeon Corporation,chlorosulfonated polyethylene such as Hypalon 20 by DuPont Corporation,and the like. In this case, the first adhesive layer 1 a can be formedin a manner that these materials are dissolved into a solvent, applieddirectly onto the first support 2 and dried. Further, a crosslinkingagent may be compounded in these materials as necessary. It is alsopossible to use a pressure sensitive adhesive double coated tape made ofacrylic resin, such as No. 500 by Nitto Denko Corporation, A-10, A-20,A-30 or the like by 3M Corporation, and the like. As for the siliconeresin adhesive, a suitable adhesive is a silicone rubber made fromhigh-molecular weight polydimethylsiloxane or polymethylphenylsiloxaneand containing terminal silanol groups, or a silicone adhesive whosemain ingredient is a silicone resin like a methyl silicone resin or amethylphenyl silicone resin. Various crosslinking can be performed inorder to control cohesive strength. For example, crosslinking can beperformed by an addition reaction of silane, a condensation reaction ofalkoxy, a condensation reaction of acetoxy, and a radical reaction byperoxide or the like. Commercially available adhesives of the above kindinclude YR3286 (product name, produced by GE Toshiba Silicones Co.,Ltd.), TSR1521 (product name, produced by GE Toshiba Silicones Co.,Ltd.), DKQ9-9009 (product name, produced by Dow Corning Corporation) andthe like. As for the photosensitive adhesive, for example, a dry filmresist used as an etching resist of a printed circuit board, a solderresist ink, a photosensitive buildup material of a printed circuit boardcan be employed. Specifically, H-K440 by Hitachi Chemical Co., Ltd.,Probimer by Ciba-Geigy Corporation or the like can be used.Particularly, a photovia material provided for use in a buildup wiringboard is durable to a manufacturing process of a printed wiring boardand to a process of mounting parts by soldering. Any kind of materialcan be used as such material as long as it is a copolymer containingfunctional groups which can be crosslinked by light, or a compositioncontaining monomer, and/or a composition obtained by mixing functionalgroups which can be crosslinked by heat in stead of light and a thermalpolymerization initiator.

The first adhesive layer 1 a may be epoxy resin, brominated epoxy resin,cycloaliphatic epoxy resin such as rubber-modified epoxy resin andrubber-dispersed epoxy resin, or bisphenol A epoxy resin and acidmodifications of these epoxy resins. Particularly, when photo-curing isperformed by illumination, modifications made of these epoxy resins andunsaturated acid are preferred. Unsaturated acid may include maleicanhydride, tetrahydrophthalic anhydride, itaconic acid anhydride,acrylic acid, methacrylic acid, and the like. These modifications areobtained by reacting unsaturated carboxylic acid with epoxy groups ofepoxy resin with a compounding ratio in which an amount of unsaturatedcarboxylic acid is equal to or less than epoxy groups. Apart from theabove, a thermosetting material such as melamine resin and cyanate esterresin, or a combination of such thermosetting material and phenolicresin is also a part of favorable application examples. In addition, acombination of such resin and a material which adds flexibility is alsofavorable. Examples of this include acrylonitrile-butadiene rubber,natural rubber, acrylic rubber, SBR, carboxylic acid-modifiedacrylonitrile-butadiene rubber, carboxylic acid-modified acrylic rubber,crosslinking NBR particles, carboxylic acid-modified crosslinking NBRparticles and the like. By adding various resin components, a curingmaterial can be provided with various properties while maintaining basicproperties such as photo-curing and thermosetting. For example, acombination with epoxy resin or phenolic resin can add good electricalinsulating properties to a curing material. When a rubber component iscompounded, a curing material is provided with toughness, and, at thesame time, the surface of the curing material can be roughened easily bysurface treatment using an oxidizing chemical solution. Further,additives (polymerization stabilizer, leveling agent, pigment, dye andthe like), which are commonly used, may also be added. It is perfectlyacceptable to compound a filler. The filler may include inorganicmicroparticles such as silica, fused silica, talc, alumina, hydratedalumina, barium sulfate, calcium hydroxide, aerosol, and calciumcarbonate, organic microparticles such as powdered epoxy resin andpowdered polyimide particles, and powdered polytetrafluoroethyleneparticles. These fillers may be subjected to coupling treatment inadvance. Dispersion of these fillers can be achieved by a known mixingmethod such as a kneader, a ball mill, a bead mill, and a triple-rollmill. A method of forming a photosensitive resin of this kind may be acoating method such as a roll coating, curtain coating and dip coating,and a method of producing films of an insulating resin on a carrier filmand sticking the films together by a laminator. Specifically, aphoto-via film BF-8000 by Hitachi Chemical Co., Ltd. or the like can beused.

Earlier-described various materials for the first support 2 can be usedfor the second support 6. Further, the second adhesive layer 1 b isinserted between the second support 6 and the second hollow filamentgroup constituted by the plurality of hollow filaments 511 to 518. Thisis preferable since the first hollow filament group constituted by theplurality of hollow filaments 501 to 508 and the second hollow filamentgroup constituted by the plurality of hollow filaments 511 to 518 areprovided with increased protection. By selecting a mesh-like film or aporous film as the second support 6, a problem such as trapped airbubbles when laminating becomes difficult. This mesh-like film or afabric may be a polyester mesh TB-70 by Tokyo Screen Co., Ltd. Theporous film may be Duragard by Celanese Chemicals, Ltd., Celgard 2400 byDaicel Chemical Industries, Ltd., for example.

The earlier-described various materials for the first adhesive layer 1 acan be used for the second adhesive layer 1 b.

(Manufacturing Method of Support Unit for Microfluidic System)

Next, a manufacturing method of the support unit for a microfluidicsystem according to the first embodiment of the present invention isdescribed using FIGS. 2 to 8.

(a) First of all, as shown in FIG. 2, the first adhesive layer 1 a isformed on the surface of the first support 2 to have the same shape andapproximately the same size as the first support 2. Then, as shown inFIGS. 3A and 3B, four rectangle release layers 3 a, 3 b, 3 c, and 3 dare equally formed on the peripheral portions of the surface of thefirst adhesive layer 1 a. These release layers 3 a, 3 b, 3 c and 3 d areformed on the surface of the first adhesive layer 1 a by a method ofapplying a commercially available release agent or stickingrelease-films to predetermined portions of the surface of the firstadhesive layer 1 a. Next, slits 4 a, 4 b, 4 c and 4 d are provided inthe first support 2 by a cutter or the like. For example, the slits aremade at positions adjacent to the inner lines of the respective fourrelease layers 3 a, 3 b, 3 c and 3 d.

(b) Next, as shown in FIGS. 4A and 4B, the first hollow filament groupconstituted by the plurality of hollow filaments 501 to 508 is laid in avertical direction from the release layer 3 b towards the release layer3 d, on the surface of the first support 2 on which the first adhesivelayer 1 a is formed. Although not illustrated, an NC wiring machine 61similar to that shown in FIG. 5A is used when laying the first hollowfilament group. (There is a wiring machine disclosed in Japanese PatentLaid-Open Publication (Kokai) No. 2001-59910 as such a wiring machine.Further, a machine disclosed in Japanese Examined Patent Publication(Kokoku) No. Showa 50(1975)-9346 can apply a load and ultrasonicvibration while wiring. Furthermore, a machine disclosed in JapaneseExamined Patent Publication (Kokoku) No. Heisei 7(1995)-95622 is capableof applying a load and emitting a laser beam.) The NC wiring machine 61is numerically controlled and is capable of controlling outputs ofultrasonic vibration and a load. By using this NC wiring machine 61, alaid pattern of the first hollow filament group constituted by theplurality of hollow filaments 501 to 508 can be precisely controlled.Specifically, the NC wiring machine 61 applies a load and vibration byan ultrasonic wave to the first hollow filament group constituted by thehollow filaments 501 to 508, while moving in parallel with the firstsupport 2.

(c) Next, as shown in FIGS. 5A and 5B, the second hollow filament groupconstituted by the plurality of hollow filaments 511 to 518 is laid in adirection from the release layer 3 a towards the release layer 3 cintersecting with the first hollow filament group constituted by theplurality of hollow filaments 501 to 508 which has already been laid. Asshown in FIG. 5A, the NC wiring machine 61 is used when laying thesecond hollow filament group. Thus, a laid pattern of the second hollowfilament group constituted by the plurality of hollow filaments 511 to518 can be controlled precisely. Specifically, the NC wiring machine 61applies a load and vibration by an ultrasonic wave to the second hollowfilament group constituted by the plurality of hollow filaments 511 to518, while moving in parallel with the first support 2. However, the NCwiring machine 61 is set to stop a load and ultrasonic vibration at theposition where the first hollow filament group constituted by the hollowfilaments 501 to 508 and the second hollow filament group constituted bythe hollow filaments 511 to 518 intersect with each other. By stopping aload and/or ultrasonic vibration near the intersection of the firsthollow filament group and the second hollow filament group, stress onthe hollow filaments 501 to 508 and 511 to 518 is reduced, and breakageof the hollow filaments 501 to 508 and 511 to 518 can be prevented.

(d) Next, as shown in FIGS. 6A and 6B, the second adhesive layer 1 bhaving the same shape and almost the same size as the first support 2 isformed so as to cover the first hollow filament group constituted by theplurality of hollow filaments 501 to 508 and the second hollow filamentgroup constituted by the plurality of hollow filaments 511 to 518, whichhave already been laid. Further, the second support 6 having the sameshape and size as the first support 2 is prepared and adhered(laminated) onto the second adhesive layer 1 b. Various methods areconsidered for laminating the second support 6. Where the second support6 is a mesh-like film or a porous film, this protection film can beclosely adhered to the second adhesive layer 1 b without air trapped inthe interface, by applying a little pressure. However, where the secondsupport 6 is a uniform film, there is no way to avoid air bubblesremaining in the interface. In this case, pressing the film with highpressure may be considered, but a large force is applied onto the hollowfilaments 501 to 508 and 511 to 518 and the hollow portions of thefilaments are deformed. Further, there is a problem in that, forexample, a large force is locally applied onto the intersection betweenthe first hollow filament group and the second hollow filament group,and the filaments at the intersection are broken. In such a case, it ispreferred to use a vacuum laminating machine to create a vacuum statebefore the second support 6 is closely adhered to the second adhesivelayer 1 b and, thereafter, to press and bond the second support 6 to thesecond adhesive layer 1 b at low pressure. This is because there will beno air trapped in the interface, and a large stress does not remain inthe hollow filaments 501 to 508 and 511 to 518, causing no breakage ofthe hollow filaments.

(e) Thereafter, the support unit is cut along a cutting line 7 in adesired shape shown by a dotted line in FIG. 7B. A method of making thesupport unit for a microfluidic system into the desired shape is cuttingthe support unit by a cutter or cutting the same by pressing a metalblade fabricated to have the desired shape in advance. However,automation of cutting with a cutter is difficult, and, as for the blade,fabrication of jigs takes time and effort. Therefore, it is preferred touse an NC driven laser beam machine as it only requires data preparationto operate. Further, with regard to the laser beam machine, it ispreferred to use a laser beam driller for drilling small diameter holesin a printed circuit board rather than a machine with a large outputdesignated for cutting. The laser beam driller for a printed circuitboard is preferred since it has a large energy output per unit period,drills a hole by a plurality of shots at the same position, and moves bya measure of about half the diameter of the hole, thus causing the verysmall number of laser scorches. As shown in FIG. 7B, the support unit iscut along a cutting line 7 set so as to overlap positions 4 a where theslits 4 a, 4 b, 4 c and 4 d are made in advance. As shown in FIG. 7A, bymaking the slits 4 a, 4 b, 4 c and 4 d in advance, the first adhesivelayer 1 a and the second adhesive layer 1 b are automatically peeled offnear the end of the hollow filament 518. Although not illustrated, atthe ends of the other hollow filaments 501 to 508, 511, 512, 513, . . ., 517, the first adhesive layer 1 a and the second adhesive layer 1 bare similarly peeled off automatically. The first hollow filament groupconstituted by the plurality of hollow filaments 501 to 508 and thesecond hollow filament group constituted by the plurality of hollowfilaments 511 to 518 are laid on the first adhesive layer 1 a.Thereafter, the second support 6 is adhered to the hollow filamentsthrough the second adhesive layer 1 b. With this construction, a processof exposing the ends of the plurality of hollow filaments 501 to 508 and511 to 518 becomes complicated. Therefore, the slits 4 a, 4 b, 4 c and 4d are provided in advance at the boundary lines between the portionswhich are unnecessary and removed ultimately and the portion to remainas the first support 2, thus facilitating the process of exposing theends of the hollow filaments 501 to 518 and 511 to 518.

(f) After cutting the support unit along the cutting line 7 shown by thedotted line in FIG. 7B, the release layer 3 b and the release layer 3 dpositioned near the ends of the hollow filaments 501 to 508 are removed,and further, the release layer 3 a and the release layer 3 c positionednear the ends of the hollow filaments 511 to 518 are removed. Thus, thesupport unit for a microfluidic system shown in FIGS. 1A and 1B iscompleted.

As described above, the release layers 3 a, 3 b, 3 c and 3 d areprovided on the surfaces of the ends of the first support 2 which becomeunnecessary and are ultimately removed, as shown in FIGS. 4A and 4B.This makes it even easier to carry out the process of drawing out thefirst hollow filament group constituted by the plurality of hollowfilaments 501 to 508 and the second hollow filament group constituted bythe plurality of hollow filaments 511 to 518 respectively from the endsof the support unit for a microfluidic system. However, care should betaken for the lengths of the exposed portions of the hollow filaments501 to 508 and 511 to 518. The reason is as follows. The unexposedportions of the hollow filaments 501 to 508 and 511 to 518 are fixed,and it is thus easy to control factors such as temperature, flowvelocity distribution, electrophoretic velocity distribution, andapplied voltage, of the fluid within the hollow filaments 501 to 508 and511 to 518. Meanwhile, the exposed portions of the hollow filaments 501to 508 and 511 to 518 are not fixed and are in a free state, and it isthus difficult to control each of the above factors. Further, carelesshandling easily causes breakage of the exposed portions of the hollowfilaments 501 to 508 and 511 to 518. Therefore, it is important to makethe lengths of the exposed portions as short as possible, and it ispreferred that the lengths of the exposed portions be at least shorterthan the lengths of the unexposed portions.

Moreover, in the manufacturing method of the support unit for amicrofluidic system according to the first embodiment of the presentinvention, the hollow members (hollow filaments) 501 to 508 and 511 to518 are used. Therefore, appropriate thoughts should be put into designand manufacturing. Apart from the laying conditions on the intersectionbetween the first hollow filament group and the second hollow filamentgroup, there are thoughts put on forming conditions of the secondsupport 6 serving as a protection film layer. Further, considerationsshould be made regarding laying conditions of the respective straightportions of the first hollow filament group constituted by the pluralityof hollow filaments 501 to 508 and the second hollow filament groupconstituted by the plurality of hollow filaments 511 to 518, andcurvature conditions on the hollow filaments 501 to 508 and 511 to 518.These conditions cannot be set generally since they largely depend onthe material of the hollow filaments 501 to 508 and 511 to 518 and thespecification of the first adhesive layer 1 a. In other words, it isrequired to set design and manufacturing conditions suitable for thehollow filaments 501 to 508 and 511 to 518 and the first adhesive layer1 a to be used. If this operation is neglected, good hollow portionscannot be ensured and, in addition, defects occur in the hollowfilaments 501 to 508 and 511 to 518, causing incidents such as leakageof a fluid.

Second Embodiment

As shown in FIGS. 8A and 8 b, a support unit for a microfluidic systemaccording to a second embodiment of the present invention is differentfrom the support unit for a microfluidic system according to the firstembodiment of the present invention shown in FIGS. 1A and 1B in that thesupport unit for a microfluidic system according to the secondembodiment has an relay portion 8. The first adhesive layer 1 a, thesecond adhesive layer 1 b, and the second support 6 form the wallportion of the relay portion 8, and the first support 2 is the bottomportion of the same. The rest is similar to the first embodiment, andduplicated description is thus omitted.

As shown in FIGS. 8A and 8B, the relay portion 8 has a constructionwhere hollow filaments 58 are exposed between the first adhesive layer 1a and the second adhesive layer 1 b. The exposed hollow filaments 58discharge a fluid. The relay portion 8 enables the discharged fluid tobe mixed or branched. The shape and size of the relay portion 8 may bedecided depending on the flow quantity of the fluid. For example, wherethe total thickness of flow channels formed by two or three hollowfilaments 58 with φ200 μm, and the first adhesive layer 1 a and thesecond adhesive layer 1 b, which hold the hollow filaments 58, is 200μm, the relay portion 8 may have a cylindrical shape with about φ2 mm toφ7 mm.

Laser beam machining is preferred for removal of the first adhesivelayer 1 a, the second adhesive layer 1 b, and the hollow filaments 58 ata predetermined position which becomes the relay portion 8. Laser beammachining is particularly preferred where the volume of the removedportion, that is, the volume of the relay portion 8 is as small as avolume in cubic millimeters or smaller. A laser used for laser beammachining is a carbon dioxide gas laser, a YAG laser, an excimer laser,and the like, and may be selected depending on the materials of thefirst adhesive layer 1 a, the second adhesive layer 1 b, and the hollowfilament 58. Note that, where the relay portion 8 is formed by a laser,it is preferred to use the first support 2 with a metal thin film suchas a copper or aluminum film formed on the surface thereof. The metalthin film serves as a laser beam stopper. When the volume of the relayportion 8 is in cubic centimeters or larger and a large area is thusremoved, machining by a drill or the like may be applied. In the case ofmachining, a desmear treatment for removing resin shavings producedwhile cutting is added.

A method of allowing the second support 6 to be a part of the relayportion 8 may be a process of machining the second support 6 to have ashape so that the second support 6 becomes a part of the relay portion8. This process is carried out after the second support 6 is adhered tothe second adhesive layer 1 b. In this case, a method of sticking thesecond support 6 by a needle such as an injection needle, or the like,is appropriate.

Further, another method may be a method of machining the second support6 to have a shape so that the second support 6 becomes a part of relayportion 8, simultaneously with the formation of the relay portion 8 inthe first adhesive layer 1 a and the second adhesive layer 1 b. In thiscase, a method of machining the entire layers at once by the foregoinglaser, or the like, is appropriate.

Further, yet another method may be a method of machining the secondsupport 6 in advance to have a shape so that the second support 6becomes a part of the relay portion 8, and then adhering the secondsupport 6 to the second adhesive layer 1 b. The method of machining thesecond support 6 may be drilling, punching, laser beam machining or thelike.

According to the support unit for a microfluidic system according to thesecond embodiment of the present invention, provision of the relaypotion 8 makes it possible to mix or branch a fluid flowing through thehollow filaments 58. Further, the second support 6 becomes a part of therelay portion 8. Thus, the relay portion 8 can have an open structure,enabling a new fluid to be filled into the relay portion from outsideand enabling the fluid within the relay portion 8 to be removed.

EXAMPLE 1

Kapton 300H by DuPont Corporation with a thickness of 75 μm was used asthe first support 2. On the surface of the first support 2, a VBH A-10film by 3M Corporation having a thickness of 250 μm and stickiness atroom temperature was laminated by a roll laminator as shown in FIG. 2.As shown in FIGS. 3A and 3B, one-sided release paper was provided as therelease layers 3 a, 3 b, 3 c and 3 d at desired positions on the firstsupport 2 so that the release surfaces were closely adhered to theadhesive surface. Further, as shown in FIGS. 4A and 4B, the slits 4 a, 4b, 4 c and 4 d were made by a cutter at desired positions in the firstsupport 2. Then, as shown in FIG. 5A, the hollow filaments 501 to 508and 511 to 518 constituted by high-performance engineering plastic tubesby Nirei Industry Co., Ltd. (material: PEEK, inner diameter of 0.2 mm,outer diameter 0.4 mm) 62 were laid onto the first support 2 by using anNC wiring machine 61 which is capable of output control of ultrasonicvibration and a load and capable of moving an X-Y table by NC control. Alord of 80 g and vibration by an ultrasonic wave with frequency of 30kHz were applied to the hollow filaments 501 to 508 and 511 to 518 to belaid. As shown in FIG. 5B, the hollow filaments 501 to 508 and 511 to518 were laid to have an arcuate shape with a radius of 5 mm and anintersection therebetween was provided. The load and ultrasonicvibration could be stopped near the intersection. Kapton 300H by DuPontCorporation, on which a VBH A-10 film by 3M Corporation was laminated bythe use of a roll laminator, was used as the second support 6. Thesecond support 6 was laminated by a vacuum laminator on the surface ofthe second filament group constituted by the plurality of hollowfilaments 511 to 518, as shown in FIGS. 6A and 6B. Thereafter, a laserbeam driller for drilling small diameter holes in a printed circuitboard was used for machining of the outer shape, and a hole with φ0.2 mmwas made at an interval of 0.1 mm with a pulse width of 5 ms and fourshots, and the support unit was cut into a wide cross shape along thedesired cutting line 7 shown in FIG. 7B. At this time, the support unitwas cut so as to overlap the portions where the slits 4 a, 4 b, 4 c and4 d had been respectively made in advance in the positions where theeight hollow filaments in 0.4 mm-pitch were collectively in flat cableshape. Thereafter, the portions of the first support 2, where therelease layers 3 a, 3 b, 3 c and 3 d had been stuck near the ends of thehollow filaments 501 to 508 and 511 to 518, could be easily removed.Then, a support unit for a microfluidic system was fabricated so thatthe support unit had a shape where the first hollow filament groupconstituted by eight hollow filaments 501 to 508 with an overall lengthof 20 cm and the second hollow filament group constituted by the hollowfilaments 511 to 518 with an overall length of 20 cm were exposed attheir ends, and the length of each exposed end was 10 mm. There was nobreakage in the entire portions where the hollow filaments were laid,particularly in the portion where the hollow filaments intersect witheach other.

As a result, variations in positions of the flow channels formed by thefirst hollow filament group constituted by the plurality of hollowfilaments 501 to 508 and the second hollow filament group constituted bythe plurality of hollow filaments 511 to 518 were within +/−10 μm orsmaller with reference to a design drawing. The support unit for amicrofluidic system was put in a thermoregulator, and the temperaturewas maintained at 80 degrees centigrade. Liquid color ink was then flownfrom one ends of the hollow filaments, and duration of time until theink was flown out were measured by a measurement instrument such as astopwatch. The ink flew out from the other ends of the eight hollowfilaments almost at the same moment (+/−1 second or shorter).

EXAMPLE 2

A 0.5 mm-thick aluminum plate was used as the first support 2. Then, asshown in FIG. 2, a non-stick pressure sensitive adhesive S9009 by DowCorning Asia Ltd. was laminated onto the surface of the aluminum plateas the first adhesive layer 1 a by a roll laminator. Further, as shownin FIGS. 3A and 3B, the release layers 3 a, 3 b, 3 c and 3 d made ofone-sided release paper were provided as films without stickiness ontothe surfaces of the portions of the first adhesive layer 1 a, which werenear the ends of the hollow filaments and would be unnecessary. Therelease layers 3 a, 3 b, 3 c were provided so that the release surfacesthereof were closely adhered to the adhesive surface. As shown in FIGS.4A and 4B and FIGS. 5A and 5B, glass tubes ESG-2 by Hagitec Co., Ltd.(inner diameter of 0.8 mm and outer diameter of 1 mm) were laid on theabove layers by using the NC wiring machine 61 capable of output controlof ultrasonic vibration and a load, and capable of moving an X-Y tableby NC control. A lord of 100 g and vibration by an ultrasonic wave withfrequency of 20 kHz were applied to the hollow filaments 501 to 508 and511 to 518 to be laid. As shown in FIG. 5B, the hollow filaments 501 to508 and 511 to 518 were laid to have an arcuate shape with a radius of10 mm and an intersection therebetween was provided. The load and anultrasonic vibration were stopped near the intersection. Kapton 200H byDuPont Corporation, which is the same as the film support, was used asthe second support 6 and laminated by a vacuum laminator on the supportunit on which the hollow filaments 501 to 508 and 511 to 518 had beenlaid, as shown in FIGS. 6A and 6B. At this time, thermocouples fortemperature measurement were buried near the inlet, outlet andintersection of the hollow filaments 501 to 508 and 511 to 518.Thereafter, for machining of the outer shape shown in FIGS. 7A and 7B,the support unit was cut into a desired shape by using an outer shapeprocess machine for a printed circuit board. At this time, the supportunit was cut so as to overlap the portions where the slits 4 a, 4 b, 4 cand 4 d had been respectively made in the portion where twelve hollowfilaments with 1 mm-pitch were collectively in flat cable shape.Thereafter, the portions of the support, where the non-stick films hadbeen stuck near the ends of the plurality of hollow filaments 501 to 508and 511 to 518, could be easily removed. Then, a support unit for amicrofluidic system was fabricated to have a shape where the twelvehollow filaments 501 to 508 and 511 to 518 with an overall length of 40cm were exposed with each exposed portion having a length of 50 mm.Variations in positions of the flow channels formed by the hollowfilaments 501 to 508 and 511 to 518 were within +/−20 μm or smaller withreference to a design drawing. There was no breakage in the entireportions where the hollow filaments were laid, particularly in theportion where the hollow filaments 501 to 508 and 511 to 518 intersectwith each other.

A film heat FTH-40 by Kyohritsu Electronic Industry Co., Ltd. was stuckto the entire back surface of the aluminum plate and temperature was setat 90 degrees centigrade. Water at about 20 degrees centigrade was flownfrom the one ends of the hollow filaments, and temperature of waterflown out from the other ends was measured. The measured temperature was88 +/−1 degrees centigrade. Moreover, temperature at the inlet, outletand intersection was 89 +/−0.5 degrees centigrade, and temperature couldbe accurately regulated.

EXAMPLE 3

As shown in FIGS. 8A and 8B, a copper-clad laminate (plate thickness of0.2 mm) having 18 μm-thick copper on its surface was used as the firstsupport 2. On the surface of the copper-clad laminate, a pressuresensitive adhesive S9009 by Dow Corning Asia Ltd. (thickness of 200 μm),which is non-stick at room temperature, was laminated by a rolllaminator as the first adhesive layer 1 a and the second adhesive layer1 b. High-performance engineering plastic tubes by Nirei Industry Co.,Ltd. (material: PEEK, inner diameter of 0.2 mm, outer diameter of 0.4mm) were laid by using a wiring machine for multi-wiring, which iscapable of output control of ultrasonic vibration and a load and capableof moving an X-Y table by NC control. A load of 80 g and vibration by anultrasonic wave with frequency of 30 kHz were applied to the hollowfilaments 58 to be laid. The hollow filaments 58 were laid to have anarcuate shape with a radius of 5 mm and an intersection therebetween wasprovided. The load and ultrasonic vibration was stopped near theintersection. Kapton 200H by DuPont Corporation, on which S9009 by DowCorning Asia Ltd. (thickness of 200 μm) was laminated by a rolllaminator, was used as the second support 6. The second support 6 waslaminated by a vacuum laminator on the surface where the hollowfilaments 58 were laid.

Thereafter, a laser beam driller for small diameter holes in a printedcircuit board was used with a pulse width of 5 ms and 4 shots to make ahole with φ0.2 mm in the second support 6, the first adhesive layer 1 a,the second adhesive layer 1 b and the hollow filaments 58, at theposition which would be the relay portion 8. Thereafter, a router wasused to process the outer shape, thus fabricating a support unit for amicrofluidic system having the relay portion 8 where a plurality of flowchannels is connected to each other.

OTHER EXAMPLES

The present invention has been described based on the foregoing aspects.However, it should be understood that. the sections and drawingsconstituting a part of this disclosure do not limit this invention.Various alternative embodiments, examples and application technologieswill be apparent to those skilled in the art from this disclosure.

For example, as shown in FIG. 9A, a through hole is provided in a partof the support unit for a microfluidic system. The support unit may beused like a micropump or a microvalve which applies a time-periodicforce to a part of a hollow filament 58 by using a motor with a cam, orthe like, to deform the hollow filament at the position where the forceis applied, thus moving a fluid at the position and causing pulsatingflow. In this case, it is preferred that the hollow filament 58 haveelasticity. In particular it is preferred that Youngs modulus of thehollow filament 58 is 10³ MPa or lower.

Moreover, as shown in FIG. 9B, it is possible to form a metal film 59 ona part of the exposed hollow filament 58 to form a terminal to which avoltage or the like is applied. In this case, it is preferred that themetal film 59 be formed by plating or deposition of a single layered ormulti-layered Cu, Al, nickel (Ni), chrome (Cr), gold (Au), or the like.

Further, as shown in FIGS. 8A and 8B, the support unit for amicrofluidic system is provided with the relay portion 8 which is anopening portion. However, where the relay portion 8 is only for mixingor branching a fluid, the relay portion 8 may have a closed structurewithout removing the second support 6 as shown in FIG. 10.

Furthermore, the first hollow filament group and the second hollowfilament group do not necessarily intersect with each other at 90degrees and may only intersect with each other. Therefore, for example,not only the first and second hollow filament groups but also a thirdhollow filament group may be laid.

On the other hand, the hollow filaments do not necessarily intersectwith each other. As shown in FIGS. 11A to 11C and 12, there may be onlythe first hollow filament group constituted by the plurality of hollowfilaments 501 to 508 running in one direction.

Moreover, as shown in FIG. 13, the plurality of hollow filaments 511 to518 with curvatures may be laid.

Note that the number of the hollow filaments to be laid is notnecessarily plural. In other words, the number of the hollow filamentsto be laid may be single.

INDUSTRIAL APPLICABILITY

As described above, according to the present invention, it is possibleto provide a support unit for a microfluidic system, which is easilymanufactured and has a long flow channel in centimeters that does notlimit the number of steps and an amount of a fluid for reaction andanalysis.

As a result, according to the present invention, it is possible toprovide a fluidic circuit (a microfluidic system) with good accuracy andfewer manufacturing variations. Further, it is possible tothree-dimensionally lay the first hollow filament group constituted bythe plurality of hollow filaments and the second hollow filament groupconstituted by the plurality of hollow filaments, which intersects withthe first hollow filament group orthogonally. Thus, a small microfluidicsystem can be provided even with a complicated flow circuit.

Moreover, according to the present invention, it is possible to providea support unit for a microfluidic system in which hollow filaments arearrayed to serve as fluidic channels, and a method of manufacturing sucha support unit for a microfluidic system with good accuracy and lessmanufacturing variations.

1-16. (canceled)
 17. A support unit for a microfluidic system, comprising: a first support; a first adhesive layer provided on a surface of the first support; a hollow filament disposed on a surface of the first adhesive layer in an arbitrary shape and functioning as a flow channel layer of the microfluidic system; and a second support provided on the first support and the hollow filament.
 18. The support unit for a microfluidic system according to claim 17, wherein the hollow filament is partially exposed from the first support.
 19. The support unit for a microfluidic system according to claim 17, wherein an end of the hollow filament exposes from the first support.
 20. The support unit for a microfluidic system according to claim 17, wherein a metal film is formed on a part of at least one of the hollow filament.
 21. The support unit for a microfluidic system according to claim 17, wherein the hollow filament is partially provided with an optically transparent portion.
 22. The support unit for a microfluidic system according to claim 17, wherein the hollow filament has light permeability.
 23. The support unit for a microfluidic system according to claim 17, wherein laying shape of the hollow filament being fixed by the first adhesive layer.
 24. The support unit for a microfluidic system according to claim 17, wherein there is a cavity in circumference of the hollow filament.
 25. The support unit for a microfluidic system according to claim 17, wherein a terminal or a circuit is formed on a surface of at least one of the first support and the second support.
 26. The support unit for a microfluidic system according to claim 17, wherein at least one part selected from the group consisting of a micromachine, a heat generation element, a piezoelectric element, a sensor, an electronic part, and a light part is formed on a surface at least one of the first support and the second support. 